{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11984432","patent":{"patent_number":"US-11984432","title":"Semiconductor chip stack module and method of fabricating the same","assignee":null,"inventors":[],"filing_date":"2021-11-23T00:00:00.000Z","publication_date":"2024-05-14T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"A semiconductor chip stack module that includes a substrate, two first semiconductor chips supported by the substrate, and a second semiconductor chip stacked on both of the two first semiconductor chips. The second semiconductor chip is electrically connected to both of the two first semiconductor chips by a conductive paste configured between the second semiconductor chip and both of the two first semiconductor chips. As multiple standard chips are stacked in the power module, and their number as well as the connection methods (e.g. series or parallel) are flexible so that the user can choose which electric characteristic(s) to be increased in the power module with the stacked chips."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor chip stack module and method of fabricating the same","description":"A semiconductor chip stack module that includes a substrate, two first semiconductor chips supported by the substrate, and a second semiconductor chip stacked on both of the two first semiconductor ch","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11984432","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11984432","citation_suggestion":"Patentable. \"Semiconductor chip stack module and method of fabricating the same\" (US-11984432). https://patentable.app/patents/US-11984432","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11984432","json":"https://patentable.app/api/llm-context/US-11984432","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T11:55:04.400Z"}