{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11988468","patent":{"patent_number":"US-11988468","title":"Heat sink and housing assembly","assignee":null,"inventors":[],"filing_date":"2019-09-30T00:00:00.000Z","publication_date":"2024-05-21T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":20,"abstract":"A heat sink includes a heat sink body having a plurality of stacked fins and a mounting base. The mounting base has a first heat dissipation plate and a second heat dissipation plate. A first surface of the first heat dissipation plate is connected to a bottom of the heat sink body. The second heat dissipation plate is mounted on a second surface of the first heat dissipation plate opposite to the first surface."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Heat sink and housing assembly","description":"A heat sink includes a heat sink body having a plurality of stacked fins and a mounting base. The mounting base has a first heat dissipation plate and a second heat dissipation plate. A first surface ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11988468","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11988468","citation_suggestion":"Patentable. \"Heat sink and housing assembly\" (US-11988468). https://patentable.app/patents/US-11988468","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11988468","json":"https://patentable.app/api/llm-context/US-11988468","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T09:45:36.487Z"}