{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11990393","patent":{"patent_number":"US-11990393","title":"Semiconductor device including resin with a filler for encapsulating bridge member connected to a substrate","assignee":null,"inventors":[],"filing_date":"2021-12-21T00:00:00.000Z","publication_date":"2024-05-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":1,"abstract":"A semiconductor device includes a semiconductor element, a lead frame, a bridge member, and a sealing resin. The semiconductor element has first and second surfaces opposite from each other, and has first and second electrodes respectively exposed on the first and second surfaces. The lead frame includes a mounting portion and a non-mounting portion divided from the mounting portion. The mounting portion has a mounting surface to which the semiconductor element is mounted and the first electrode is electrically connected, and an opposite surface opposite from the mounting surface. The bridge member electrically connects the second electrode and the non-mounting portion. The sealing resin has electric insulation, has a thermal conductivity of 2.2 W or more, and covers the semiconductor element, the lead frame, and the bridge member in a state where the opposite surface of the mounting portion is exposed from the sealing resin."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device including resin with a filler for encapsulating bridge member connected to a substrate","description":"A semiconductor device includes a semiconductor element, a lead frame, a bridge member, and a sealing resin. The semiconductor element has first and second surfaces opposite from each other, and has f","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11990393","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11990393","citation_suggestion":"Patentable. \"Semiconductor device including resin with a filler for encapsulating bridge member connected to a substrate\" (US-11990393). https://patentable.app/patents/US-11990393","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11990393","json":"https://patentable.app/api/llm-context/US-11990393","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:17:29.169Z"}