{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11990394","patent":{"patent_number":"US-11990394","title":"Semiconductor package and a method for manufacturing of a semiconductor package","assignee":null,"inventors":[],"filing_date":"2021-09-15T00:00:00.000Z","publication_date":"2024-05-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"A semiconductor package including a lead frame, an Ag plated surface positioned on the lead frame, an adhesion promotion layer positioned on the top of the Ag plated surface, and mold body covering the top of the lead frame is provided. The Ag plated surface covers a significant part of an interconnection area of the lead frame surface, and the Ag plating surface does not exceed the area of the mold body."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package and a method for manufacturing of a semiconductor package","description":"A semiconductor package including a lead frame, an Ag plated surface positioned on the lead frame, an adhesion promotion layer positioned on the top of the Ag plated surface, and mold body covering th","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11990394","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11990394","citation_suggestion":"Patentable. \"Semiconductor package and a method for manufacturing of a semiconductor package\" (US-11990394). https://patentable.app/patents/US-11990394","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11990394","json":"https://patentable.app/api/llm-context/US-11990394","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:30:33.601Z"}