{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11990414","patent":{"patent_number":"US-11990414","title":"BEOL alternative metal interconnects: integration and process","assignee":null,"inventors":[],"filing_date":"2020-12-08T00:00:00.000Z","publication_date":"2024-05-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"Back-end-of-the line (BEOL) interconnect structures are provided in which an alternative metal such as, for example, a noble metal, is present in a combined via/line opening that is formed in an interconnect dielectric material layer. A surface diffusion dominated reflow anneal is used to reduce the thickness of a noble metal layer outside the combined via/line opening thus reducing or eliminating the burden of polishing the noble metal layer. In some embodiments and after performing the anneal, a lesser noble metal layer can be formed atop the noble metal layer prior to polishing. The use of the lesser noble metal layer may further reduce the burden of polishing the noble metal layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"BEOL alternative metal interconnects: integration and process","description":"Back-end-of-the line (BEOL) interconnect structures are provided in which an alternative metal such as, for example, a noble metal, is present in a combined via/line opening that is formed in an inter","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11990414","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11990414","citation_suggestion":"Patentable. \"BEOL alternative metal interconnects: integration and process\" (US-11990414). https://patentable.app/patents/US-11990414","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11990414","json":"https://patentable.app/api/llm-context/US-11990414","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T16:14:11.733Z"}