{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11990422","patent":{"patent_number":"US-11990422","title":"Ferrite electro-magnetic interference (EMI) shield between an integrated-circuit (IC) chip and an air-core inductor all inside a hybrid lead-frame package","assignee":null,"inventors":[],"filing_date":"2022-03-14T00:00:00.000Z","publication_date":"2024-05-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An Integrated Circuit (IC) package has a ferrite-dielectric shield between a planar inductor coil and a semiconductor chip. The shield blocks Electro-Magnetic Interference (EMI) generated by currents in the inductor coil from reaching the semiconductor chip. The shield has a ferrite layer surrounded by upper and lower dielectric laminate layers to prevent electrical shorts. The center end of the inductor coil connects to the semiconductor chip through a center post that fits through an opening in the shield that is over the air core center of the inductor coil. The center post can connect to a die attach pad that the semiconductor chip is mounted to. Bonding wires connect pads on the semiconductor chip to lead-frame pads on lead-frame risers that end at external package connectors. The outer end of the inductor coil connects to lead-frame outer risers also having external package connectors such as pins or bonding balls."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Ferrite electro-magnetic interference (EMI) shield between an integrated-circuit (IC) chip and an air-core inductor all inside a hybrid lead-frame package","description":"An Integrated Circuit (IC) package has a ferrite-dielectric shield between a planar inductor coil and a semiconductor chip. The shield blocks Electro-Magnetic Interference (EMI) generated by currents ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11990422","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11990422","citation_suggestion":"Patentable. \"Ferrite electro-magnetic interference (EMI) shield between an integrated-circuit (IC) chip and an air-core inductor all inside a hybrid lead-frame package\" (US-11990422). https://patentable.app/patents/US-11990422","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11990422","json":"https://patentable.app/api/llm-context/US-11990422","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T02:40:08.950Z"}