{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11990445","patent":{"patent_number":"US-11990445","title":"Apparatus and method for semiconductor device bonding","assignee":null,"inventors":[],"filing_date":"2019-09-10T00:00:00.000Z","publication_date":"2024-05-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"An apparatus and method for semiconductor device (such as semiconductor die or die) bonding. The apparatus has a bonding assembly with a bonding head having a bonding tool for holding a semiconductor device; and a bonding head actuation mechanism for actuating the bonding tool horizontally planarly to align the semiconductor device relative to a bonding location of a substrate while the semiconductor device remains above the bonding location. The bonding assembly has a bonding assembly actuator for actuating the bonding head vertically to pick the semiconductor device and to bond the semiconductor device at the bonding location. The apparatus has a vision assembly with alignment cameras for capturing reference views of the semiconductor device and bonding location for aligning the semiconductor device relative to the bonding location, and a vision assembly actuation mechanism for actuating the alignment cameras to position the alignment cameras between the bonding tool and bonding location."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Apparatus and method for semiconductor device bonding","description":"An apparatus and method for semiconductor device (such as semiconductor die or die) bonding. The apparatus has a bonding assembly with a bonding head having a bonding tool for holding a semiconductor ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11990445","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11990445","citation_suggestion":"Patentable. \"Apparatus and method for semiconductor device bonding\" (US-11990445). https://patentable.app/patents/US-11990445","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11990445","json":"https://patentable.app/api/llm-context/US-11990445","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T14:38:04.031Z"}