{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11990449","patent":{"patent_number":"US-11990449","title":"Dual RDL stacked die package using vertical wire","assignee":null,"inventors":[],"filing_date":"2019-01-14T00:00:00.000Z","publication_date":"2024-05-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"Embodiments include a semiconductor package, a package on package system, and a method of forming the semiconductor package. The semiconductor package includes a first redistribution layer, a stack of dies on the first redistribution layer, a second redistribution layer over the stack of dies and the first redistribution layer, and a plurality of interconnects coupled to the stack of dies and the first and second redistribution layers. The interconnects may extend substantially vertical from a top surface of the first redistribution layer to a bottom surface of the second redistribution layer. The semiconductor package may also include a mold layer between the first redistribution layer and the second redistribution layer. The plurality of interconnects may be through mold vertical wire interconnects. The first and second redistribution layers may be dual-sided redistribution layers. The semiconductor package may further include adhesive layers coupled to the stack of dies."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Dual RDL stacked die package using vertical wire","description":"Embodiments include a semiconductor package, a package on package system, and a method of forming the semiconductor package. The semiconductor package includes a first redistribution layer, a stack of","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11990449","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11990449","citation_suggestion":"Patentable. \"Dual RDL stacked die package using vertical wire\" (US-11990449). https://patentable.app/patents/US-11990449","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11990449","json":"https://patentable.app/api/llm-context/US-11990449","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T16:50:41.465Z"}