{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11995543","patent":{"patent_number":"US-11995543","title":"Wafer processing method and apparatus, storage medium and electronic device","assignee":null,"inventors":[],"filing_date":"2021-03-25T00:00:00.000Z","publication_date":"2024-05-28T00:00:00.000Z","cpc_codes":["G06N","G06N","G06T","G06V","G06T","G06T","G06V","G06V"],"num_claims":20,"abstract":"A wafer processing method and apparatus, a storage medium and an electronic device are disclosed, relating to the field of integrated circuit (IC) manufacturing and wafer stacking. The wafer processing method includes: partitioning a target wafer into one or more pre-divided areas each having one or more dies; determining area ratings for each pre-divided area based on test data of the dies in each pre-divided area; and feeding the area ratings of the pre-divided areas to a trained classification model to determine a classification category of the target wafer; identifying a second wafer having a same classification category as the target wafer; and stacking the target wafer with the second wafer. This method improves the production yield of stacked ICs."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wafer processing method and apparatus, storage medium and electronic device","description":"A wafer processing method and apparatus, a storage medium and an electronic device are disclosed, relating to the field of integrated circuit (IC) manufacturing and wafer stacking. The wafer processin","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11995543","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11995543","citation_suggestion":"Patentable. \"Wafer processing method and apparatus, storage medium and electronic device\" (US-11995543). https://patentable.app/patents/US-11995543","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11995543","json":"https://patentable.app/api/llm-context/US-11995543","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T14:42:05.806Z"}