{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11996348","patent":{"patent_number":"US-11996348","title":"Semiconductor module assembly having a cooling body and at least one semiconductor module","assignee":null,"inventors":[],"filing_date":"2022-02-21T00:00:00.000Z","publication_date":"2024-05-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":19,"abstract":"A semiconductor module assembly includes a cooling body having a cooling body main body and a cooling body attachment with a channel structure for a heat-transporting fluid. The channel structure is hermetically sealed with a cooling body main body surface so that the cooling body attachment and the cooling body main body are in direct contact with the heat-transporting fluid. The cooling body attachment includes a central piece having essentially parallel channels of the channel structure, and end pieces arranged on both sides of the central piece. Each end piece has deflection channels of the channel structure, which are arranged to establish a fluidic connection between the essentially parallel channels of the central piece. A semiconductor module contacts the cooling body, with the hermetically sealed channel structure of the cooling body attachment and the heat-transporting fluid forming a pulsating heat pipe which is thermally conductively connected to the semiconductor module."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor module assembly having a cooling body and at least one semiconductor module","description":"A semiconductor module assembly includes a cooling body having a cooling body main body and a cooling body attachment with a channel structure for a heat-transporting fluid. The channel structure is h","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11996348","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11996348","citation_suggestion":"Patentable. \"Semiconductor module assembly having a cooling body and at least one semiconductor module\" (US-11996348). https://patentable.app/patents/US-11996348","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11996348","json":"https://patentable.app/api/llm-context/US-11996348","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T09:43:08.256Z"}