{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11996357","patent":{"patent_number":"US-11996357","title":"Wiring substrate and method for manufacturing wiring substrate","assignee":null,"inventors":[],"filing_date":"2021-08-27T00:00:00.000Z","publication_date":"2024-05-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A wiring substrate includes a first conductor layer, an insulating layer on the first layer such that the insulating layer is covering the first layer, a second conductor layer on the insulating layer such that the insulating layer is formed between the first and second layers, the connection conductors penetrating through the insulating layer and connecting the first and second layers, and a coating film formed at least partially on surface of the first layer such that the film improves adhesion between the first layer and insulating layer. The first layer includes pads and wiring patterns such that the pads are in contact with the connection conductors and that the patterns have surfaces facing the insulating layer and covered by the film, and the pads have roughened surfaces facing the insulating layer and having first surface roughness that is higher than second surface roughness of the surfaces of the patterns."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wiring substrate and method for manufacturing wiring substrate","description":"A wiring substrate includes a first conductor layer, an insulating layer on the first layer such that the insulating layer is covering the first layer, a second conductor layer on the insulating layer","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11996357","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11996357","citation_suggestion":"Patentable. \"Wiring substrate and method for manufacturing wiring substrate\" (US-11996357). https://patentable.app/patents/US-11996357","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11996357","json":"https://patentable.app/api/llm-context/US-11996357","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T18:36:05.222Z"}