{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-12001367","patent":{"patent_number":"US-12001367","title":"Multi-die integrated circuit with data processing engine array","assignee":null,"inventors":[],"filing_date":"2023-05-18T00:00:00.000Z","publication_date":"2024-06-04T00:00:00.000Z","cpc_codes":["G06F","G06F","G06F","G06F"],"num_claims":20,"abstract":"An integrated circuit includes an interposer and a die coupled to the interposer. The die includes a first data processing engine (DPE) array and a second DPE array. The first DPE array includes a first plurality of DPEs and a first DPE interface coupled to the first plurality of DPEs. The second DPE array includes a second plurality of DPEs and a second DPE interface coupled to the second plurality of DPEs. The integrated circuit includes one or more other dies having a first die interface coupled to, and configured to communicate with, the first DPE interface via the interposer and a second die interface coupled to, and configured to communicate with, the second DPE interface via the interposer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Multi-die integrated circuit with data processing engine array","description":"An integrated circuit includes an interposer and a die coupled to the interposer. The die includes a first data processing engine (DPE) array and a second DPE array. The first DPE array includes a fir","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-12001367","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-12001367","citation_suggestion":"Patentable. \"Multi-die integrated circuit with data processing engine array\" (US-12001367). https://patentable.app/patents/US-12001367","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-12001367","json":"https://patentable.app/api/llm-context/US-12001367","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T11:54:38.220Z"}