{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-12002709","patent":{"patent_number":"US-12002709","title":"Interconnect structure and manufacturing method for the same","assignee":null,"inventors":[],"filing_date":"2021-08-27T00:00:00.000Z","publication_date":"2024-06-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"The present disclosure provides an interconnect structure, including a first metal line, a second metal line spaced away from the first metal line, a conductive contact over the first metal line, including a first portion, a second portion over the first portion, wherein a bottom width of the second portion is greater than a top width of the first portion, wherein a shortest distance between the second portion and the second metal line is in a range from 50 Angstrom to 200 Angstrom, and a third portion over the second portion, wherein a bottom width of the third portion is greater than a top width of the second portion, the entire first portion and the entire second portion are under a coverage of a vertical projection area of the third portion, a first layer, and a second layer over the first layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Interconnect structure and manufacturing method for the same","description":"The present disclosure provides an interconnect structure, including a first metal line, a second metal line spaced away from the first metal line, a conductive contact over the first metal line, incl","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-12002709","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-12002709","citation_suggestion":"Patentable. \"Interconnect structure and manufacturing method for the same\" (US-12002709). https://patentable.app/patents/US-12002709","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-12002709","json":"https://patentable.app/api/llm-context/US-12002709","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T16:56:07.530Z"}