{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-12002735","patent":{"patent_number":"US-12002735","title":"Semiconductor package","assignee":null,"inventors":[],"filing_date":"2021-09-08T00:00:00.000Z","publication_date":"2024-06-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor package is disclosed for efficiently facilitating heat dissipation. The semiconductor package includes a substrate layer, a chip, a housing lid and thermal-conductive liquid. A chip is disposed on the substrate layer and electrically coupled to the substrate layer. The chip includes at least one through silicon via (TSV). The housing lid is disposed above both the substrate layer and the chip. Also, the housing lid is coupled to the substrate layer at its edge for forming an internal space that encompasses the chip. The thermal-conductive liquid is filled within the internal space."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package","description":"A semiconductor package is disclosed for efficiently facilitating heat dissipation. The semiconductor package includes a substrate layer, a chip, a housing lid and thermal-conductive liquid. A chip is","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-12002735","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-12002735","citation_suggestion":"Patentable. \"Semiconductor package\" (US-12002735). https://patentable.app/patents/US-12002735","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-12002735","json":"https://patentable.app/api/llm-context/US-12002735","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T04:47:42.276Z"}