{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-12002763","patent":{"patent_number":"US-12002763","title":"Package substrate and semiconductor package including the same","assignee":null,"inventors":[],"filing_date":"2022-12-15T00:00:00.000Z","publication_date":"2024-06-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A package substrate includes: a core insulation layer having first and second package regions and a boundary region between the first and second package regions; a first upper conductive pattern in the first package region; a second upper conductive pattern in the second package region; a first insulation pattern on the core insulation layer to partially expose the first and second upper conductive patterns, wherein the first insulation pattern includes a first trench at the boundary region, and first reinforcing portions in the first trench; a first lower conductive pattern in the first package region; a second lower conductive pattern in the second package region; and a second insulation pattern on the core insulation layer to partially expose the first and second lower conductive patterns, wherein the second insulation pattern includes a second trench at the boundary region, and second reinforcing portions in the second trench."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package substrate and semiconductor package including the same","description":"A package substrate includes: a core insulation layer having first and second package regions and a boundary region between the first and second package regions; a first upper conductive pattern in th","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-12002763","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-12002763","citation_suggestion":"Patentable. \"Package substrate and semiconductor package including the same\" (US-12002763). https://patentable.app/patents/US-12002763","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-12002763","json":"https://patentable.app/api/llm-context/US-12002763","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T13:42:36.262Z"}