{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-12002779","patent":{"patent_number":"US-12002779","title":"Multilayer body and method of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2021-03-17T00:00:00.000Z","publication_date":"2024-06-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"A multilayer body includes a first electronic component and a structural body including first and second regions. The first electronic component is in the second region. The multilayer body includes a second electronic component mounted via a solder bump onto the structural body with a connection pad interposed therebetween. An outer surface of the first region and an outer surface of the first electronic component have a step difference therebetween in a height direction of the structural body. The connection pad is on the outer surface of the first region, an outer surface of the first electronic component, and a step-difference surface of a portion of the step difference."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Multilayer body and method of manufacturing the same","description":"A multilayer body includes a first electronic component and a structural body including first and second regions. The first electronic component is in the second region. The multilayer body includes a","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-12002779","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-12002779","citation_suggestion":"Patentable. \"Multilayer body and method of manufacturing the same\" (US-12002779). https://patentable.app/patents/US-12002779","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-12002779","json":"https://patentable.app/api/llm-context/US-12002779","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T04:21:22.333Z"}