{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-12002781","patent":{"patent_number":"US-12002781","title":"Semiconductor device and method for manufacturing same","assignee":null,"inventors":[],"filing_date":"2021-12-20T00:00:00.000Z","publication_date":"2024-06-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":13,"abstract":"A first substrate having a first face and a second face is prepared. The first face has a plurality of product regions defined thereon. An electrode pad forming side of each of a semiconductor chip stack and a semiconductor chip is attached to each corresponding product region of the plurality of product regions. The second face of the first substrate is thinned. A first inorganic insulating layer is formed on the second face. A first vertical interconnection penetrates the first inorganic insulating layer and the first substrate and is electrically connected to an electrode pad of the semiconductor chip stack. A second vertical interconnection penetrates the first inorganic insulating layer and the first substrate and is electrically connected to an electrode pad of the semiconductor chip. A first horizontal interconnection electrically connects a part of the first vertical interconnection to a part of the second vertical interconnection."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device and method for manufacturing same","description":"A first substrate having a first face and a second face is prepared. The first face has a plurality of product regions defined thereon. An electrode pad forming side of each of a semiconductor chip st","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-12002781","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-12002781","citation_suggestion":"Patentable. \"Semiconductor device and method for manufacturing same\" (US-12002781). https://patentable.app/patents/US-12002781","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-12002781","json":"https://patentable.app/api/llm-context/US-12002781","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T18:37:37.190Z"}