{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-12002783","patent":{"patent_number":"US-12002783","title":"Methods of manufacturing semiconductor device with bump interconnection","assignee":null,"inventors":[],"filing_date":"2021-12-10T00:00:00.000Z","publication_date":"2024-06-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Provided is a method of manufacturing a semiconductor device including a bump interconnect structure. In the method of manufacturing the semiconductor device, a first substrate including a connection pad is formed, and a bump including a solder layer and a metal post protruding from the solder layer are formed on the connection pad. A second substrate including a bump land may be formed. The first substrate may be disposed on the second substrate so that a protruding end of the metal post contacts the bump land, and the solder layer may be reflowed. Accordingly, it possible to interconnect the metal post to the bump land."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Methods of manufacturing semiconductor device with bump interconnection","description":"Provided is a method of manufacturing a semiconductor device including a bump interconnect structure. In the method of manufacturing the semiconductor device, a first substrate including a connection ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-12002783","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-12002783","citation_suggestion":"Patentable. \"Methods of manufacturing semiconductor device with bump interconnection\" (US-12002783). https://patentable.app/patents/US-12002783","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-12002783","json":"https://patentable.app/api/llm-context/US-12002783","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T16:14:46.195Z"}