{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-12002788","patent":{"patent_number":"US-12002788","title":"Bonded semiconductor devices having processor and dynamic random-access memory and methods for forming the same","assignee":null,"inventors":[],"filing_date":"2022-12-16T00:00:00.000Z","publication_date":"2024-06-04T00:00:00.000Z","cpc_codes":["H01L","H01L","G11C","G11C","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"Embodiments of semiconductor devices and fabrication methods thereof are disclosed. In an example, first semiconductor structures are formed. At least one of the first semiconductor structures includes a processor, static random-access memory (SRAM) cells, and a first bonding layer comprising first bonding contacts. Second semiconductor structures are formed. At least one of the second semiconductor structures comprises dynamic random-access memory (DRAM) cells and a second bonding layer comprising second bonding contacts. The first semiconductor structures and the second semiconductor structures are bonded. The first bonding contacts of the first semiconductor structure are in contact with the second bonding contacts of the second semiconductor structure. At least one of the first semiconductor structures and the second semiconductor structures further includes a peripheral circuit."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Bonded semiconductor devices having processor and dynamic random-access memory and methods for forming the same","description":"Embodiments of semiconductor devices and fabrication methods thereof are disclosed. In an example, first semiconductor structures are formed. At least one of the first semiconductor structures include","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-12002788","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-12002788","citation_suggestion":"Patentable. \"Bonded semiconductor devices having processor and dynamic random-access memory and methods for forming the same\" (US-12002788). https://patentable.app/patents/US-12002788","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-12002788","json":"https://patentable.app/api/llm-context/US-12002788","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T18:03:44.001Z"}