{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-12002874","patent":{"patent_number":"US-12002874","title":"Buried power rail contact","assignee":null,"inventors":[],"filing_date":"2021-07-26T00:00:00.000Z","publication_date":"2024-06-04T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor structure includes a power rail contact at least partially disposed between a first source/drain region of a first vertical fin structure and a second source/drain region of a second vertical fin structure. The power rail contact is in contact with a buried power rail disposed under the first and second vertical fin structures. The power rail contact is in contact with at least one of the first and second source/drain regions. A contact cap is disposed above the power rail contact."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Buried power rail contact","description":"A semiconductor structure includes a power rail contact at least partially disposed between a first source/drain region of a first vertical fin structure and a second source/drain region of a second v","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-12002874","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-12002874","citation_suggestion":"Patentable. \"Buried power rail contact\" (US-12002874). https://patentable.app/patents/US-12002874","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-12002874","json":"https://patentable.app/api/llm-context/US-12002874","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T12:20:32.813Z"}