{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-12004351","patent":{"patent_number":"US-12004351","title":"Integrated assemblies, and methods of forming integrated assemblies","assignee":null,"inventors":[],"filing_date":"2022-07-20T00:00:00.000Z","publication_date":"2024-06-04T00:00:00.000Z","cpc_codes":["G11C","G11C","G11C","G11C","H01L","H01L"],"num_claims":17,"abstract":"Some embodiments include an integrated assembly having a first deck. The first deck has first memory cell levels alternating with first insulative levels. A second deck is over the first deck. The second deck has second memory cell levels alternating with second insulative levels. A cell-material-pillar passes through the first and second decks. Memory cells are along the first and second memory cell levels and include regions of the cell-material-pillar. An intermediate level is between the first and second decks. The intermediate level includes a buffer region adjacent the cell-material-pillar. The buffer region includes a composition different from the first and second insulative materials, and different from the first and second conductive regions. Some embodiments include methods of forming integrated assemblies."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated assemblies, and methods of forming integrated assemblies","description":"Some embodiments include an integrated assembly having a first deck. The first deck has first memory cell levels alternating with first insulative levels. A second deck is over the first deck. The sec","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-12004351","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-12004351","citation_suggestion":"Patentable. \"Integrated assemblies, and methods of forming integrated assemblies\" (US-12004351). https://patentable.app/patents/US-12004351","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-12004351","json":"https://patentable.app/api/llm-context/US-12004351","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T16:15:04.478Z"}