{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-12008202","patent":{"patent_number":"US-12008202","title":"Touch light-emitting module having hollowed portion for incapsulation resin and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2023-05-11T00:00:00.000Z","publication_date":"2024-06-11T00:00:00.000Z","cpc_codes":["G06F","G06F","G06F"],"num_claims":18,"abstract":"A touch light-emitting module and a manufacturing method thereof are disclosed. The touch light-emitting module includes a printed circuit board and a touch-control conductor. The printed circuit board has a top surface on which a touch-control IC and a luminous unit that is electrically connected are disposed. The touch-control conductor includes a hollowed portion. The touch-control conductor is coated, on the bottom thereof, with a conductive material to combine with the top surface of the printed circuit board, so that the touch-control IC and the luminous unit are located in the hollowed portion. An encapsulation resin is then injected into a space between the printed circuit board and the hollowed portion to complete encapsulation. As such, the present invention offers a simplified structure to achieve an effect of minimization, and also simplifies the manufacturing process and reduces the working time to thereby enhance the yield."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Touch light-emitting module having hollowed portion for incapsulation resin and manufacturing method thereof","description":"A touch light-emitting module and a manufacturing method thereof are disclosed. The touch light-emitting module includes a printed circuit board and a touch-control conductor. The printed circuit boar","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-12008202","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-12008202","citation_suggestion":"Patentable. \"Touch light-emitting module having hollowed portion for incapsulation resin and manufacturing method thereof\" (US-12008202). https://patentable.app/patents/US-12008202","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-12008202","json":"https://patentable.app/api/llm-context/US-12008202","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T13:17:22.995Z"}