{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-12009272","patent":{"patent_number":"US-12009272","title":"Integral redistribution layer for WCSP","assignee":null,"inventors":[],"filing_date":"2021-11-15T00:00:00.000Z","publication_date":"2024-06-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":24,"abstract":"A wafer chip scale package (WCSP) includes a substrate including a semiconductor surface including circuitry electrically connected to die bond pads exposed by a passivation layer, and a top dielectric layer over the passivation layer. A dielectric layer bounded (DLB) cavity formed in the top dielectric layer includes a first cavity being a center through-cavity bounded by a second cavity being a partial through-cavity, the DLB cavity is lined with a seed layer. A capping dielectric layer that covers the DLB cavity except for an aperture over the first cavity. A cavity metal that is generally configured as an integral structure of continuous metal material having no interfaces is for filling the DLB cavity to form a metal filled cavity including over the aperture that has an electrical connection to the die bond pads. A solder ball over the cavity metal is positioned over the aperture."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integral redistribution layer for WCSP","description":"A wafer chip scale package (WCSP) includes a substrate including a semiconductor surface including circuitry electrically connected to die bond pads exposed by a passivation layer, and a top dielectri","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-12009272","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-12009272","citation_suggestion":"Patentable. \"Integral redistribution layer for WCSP\" (US-12009272). https://patentable.app/patents/US-12009272","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-12009272","json":"https://patentable.app/api/llm-context/US-12009272","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T10:39:04.491Z"}