{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-12009297","patent":{"patent_number":"US-12009297","title":"Semiconductor device and semiconductor package","assignee":null,"inventors":[],"filing_date":"2021-12-15T00:00:00.000Z","publication_date":"2024-06-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor device includes a semiconductor substrate having a semiconductor device on an active surface thereof. The semiconductor substrate has a quadrangular plane. An insulating layer is on the active surface of the semiconductor substrate. A passivation layer is on the insulating layer. The insulating layer includes an insulating layer central portion having a side surface extending in parallel with a side surface of the semiconductor substrate. The side surface of the insulating layer central portion is spaced apart from the side surface of the semiconductor substrate by a first size. An insulating layer corner portion is at each corner of the insulating layer central portion and protrudes from the side surface of the insulating layer central portion in a horizontal direction. The passivation layer covers the insulating layer central portion."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device and semiconductor package","description":"A semiconductor device includes a semiconductor substrate having a semiconductor device on an active surface thereof. The semiconductor substrate has a quadrangular plane. An insulating layer is on th","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-12009297","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-12009297","citation_suggestion":"Patentable. \"Semiconductor device and semiconductor package\" (US-12009297). https://patentable.app/patents/US-12009297","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-12009297","json":"https://patentable.app/api/llm-context/US-12009297","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T15:37:54.823Z"}