{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-12009301","patent":{"patent_number":"US-12009301","title":"Interconnect structure","assignee":null,"inventors":[],"filing_date":"2022-01-18T00:00:00.000Z","publication_date":"2024-06-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An interconnect structure is provided. The interconnect structure includes a first via in a first dielectric layer, a first metal line on and electrically connected to the first via, a first etching stop layer over the first dielectric layer, a second metal line over the first etching stop layer, and an encapsulating layer. The encapsulating layer includes a first vertical portion along a sidewall of the first metal line, a horizontal portion along an upper surface of the first etching stop layer, and a second vertical portion along a sidewall of the second metal line. The interconnect structure also includes a second dielectric layer nested within the encapsulating layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Interconnect structure","description":"An interconnect structure is provided. The interconnect structure includes a first via in a first dielectric layer, a first metal line on and electrically connected to the first via, a first etching s","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-12009301","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-12009301","citation_suggestion":"Patentable. \"Interconnect structure\" (US-12009301). https://patentable.app/patents/US-12009301","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-12009301","json":"https://patentable.app/api/llm-context/US-12009301","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T08:35:55.329Z"}