{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-12009308","patent":{"patent_number":"US-12009308","title":"Semiconductor chip including through electrodes, and semiconductor package including the same","assignee":null,"inventors":[],"filing_date":"2021-05-11T00:00:00.000Z","publication_date":"2024-06-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":38,"abstract":"A semiconductor chip according to an embodiment includes a body portion with a front surface and a rear surface, the body portion being oriented in such a way that the rear surface is above the front surface, first and second through electrodes penetrating the body portion with protrusions that protrude above the rear surface of the body portion, a wiring portion formed under the front surface of the body portion, a power pattern formed over the rear surface of the body portion and spaced apart from the protrusions, an interlayer insulating layer filling spaces between the power pattern and the protrusions, and first and second rear connection electrodes formed over the interlayer insulating layer and respectively connected to the first and second through electrodes, wherein the first rear connection electrode is simultaneously connected to the first through electrode and a part of the power pattern that is adjacent to the first through electrode."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor chip including through electrodes, and semiconductor package including the same","description":"A semiconductor chip according to an embodiment includes a body portion with a front surface and a rear surface, the body portion being oriented in such a way that the rear surface is above the front ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-12009308","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-12009308","citation_suggestion":"Patentable. \"Semiconductor chip including through electrodes, and semiconductor package including the same\" (US-12009308). https://patentable.app/patents/US-12009308","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-12009308","json":"https://patentable.app/api/llm-context/US-12009308","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T18:37:10.987Z"}