{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-12009316","patent":{"patent_number":"US-12009316","title":"Semiconductor structure and method of manufacturing a semiconductor structure","assignee":null,"inventors":[],"filing_date":"2021-04-29T00:00:00.000Z","publication_date":"2024-06-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor structure includes a first die having a first surface and a second surface opposite to the first surface, a conductive bump disposed at the first surface, and an RDL under the conductive bump. The RDL includes an interconnect structure and a dielectric layer, and the interconnect structure is electrically connected to the first die through the conductive bump. The semiconductor structure further includes a molding over the RDL and surrounding the first die and the conductive bump, an adhesive over the molding and the second surface, and a support element over the adhesive. A method includes providing a first die having a first surface and a second surface, a redistribution layer over the first surface, and a molding surrounding the first die; removing a portion of the molding to expose the second surface; and attaching a support element over the molding and the second surface."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor structure and method of manufacturing a semiconductor structure","description":"A semiconductor structure includes a first die having a first surface and a second surface opposite to the first surface, a conductive bump disposed at the first surface, and an RDL under the conducti","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-12009316","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-12009316","citation_suggestion":"Patentable. \"Semiconductor structure and method of manufacturing a semiconductor structure\" (US-12009316). https://patentable.app/patents/US-12009316","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-12009316","json":"https://patentable.app/api/llm-context/US-12009316","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T16:15:44.128Z"}