{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-12009320","patent":{"patent_number":"US-12009320","title":"Interconnect loss of high density package with magnetic material","assignee":null,"inventors":[],"filing_date":"2019-10-08T00:00:00.000Z","publication_date":"2024-06-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"Embodiments include package substrates and a semiconductor package with such package substrates. A package substrate includes a first conductive layer in a first magnetic layer, and a second magnetic layer over the first magnetic layer, where the first and second magnetic layers include magnetic materials. The package substrate also includes a second conductive layer in the second magnetic layer. The second conductive layer includes a plurality of first traces fully surrounded by the first and second magnetic layers. The package substrate includes a third conductive layer over the second magnetic layer. The magnetic materials may include manganese Mn ferrite materials, Zn/Mn ferrite materials, or Ni/Zn ferrite materials. The magnetic materials include material properties with a low constant value, a magnetic tangent value, a frequency, a base filler chemistry, a filler shape, a filler orientation, a filler percentage, a loading fraction value, a permeability, an insertion loss, and a resin formulation."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Interconnect loss of high density package with magnetic material","description":"Embodiments include package substrates and a semiconductor package with such package substrates. A package substrate includes a first conductive layer in a first magnetic layer, and a second magnetic ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-12009320","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-12009320","citation_suggestion":"Patentable. \"Interconnect loss of high density package with magnetic material\" (US-12009320). https://patentable.app/patents/US-12009320","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-12009320","json":"https://patentable.app/api/llm-context/US-12009320","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T14:37:52.604Z"}