{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-12009328","patent":{"patent_number":"US-12009328","title":"Semiconductor package and method of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2022-04-07T00:00:00.000Z","publication_date":"2024-06-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor package includes a chip including a pad; a first insulation pattern on the chip and exposing the pad; a redistribution layer (RDL) on an upper surface of the first insulation pattern and connected to the pad; a second insulation pattern on the upper surface of the first insulation pattern and including an opening exposing a ball land of the RDL and a patterned portion in the opening; an under bump metal (UBM) on upper surfaces of the second insulation pattern and patterned portion and filling the opening, the UBM including a first locking hole exposing an edge of an upper surface of the ball land; and a conductive ball on an upper surface of the UBM and including a first locking portion in the first locking hole. The first locking hole may be about 10% to about 50% of the area of the UBM upper surface."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package and method of manufacturing the same","description":"A semiconductor package includes a chip including a pad; a first insulation pattern on the chip and exposing the pad; a redistribution layer (RDL) on an upper surface of the first insulation pattern a","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-12009328","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-12009328","citation_suggestion":"Patentable. \"Semiconductor package and method of manufacturing the same\" (US-12009328). https://patentable.app/patents/US-12009328","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-12009328","json":"https://patentable.app/api/llm-context/US-12009328","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T07:47:30.613Z"}