{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-12009329","patent":{"patent_number":"US-12009329","title":"Manufacturing method of integrated substrate","assignee":null,"inventors":[],"filing_date":"2021-08-09T00:00:00.000Z","publication_date":"2024-06-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":10,"abstract":"A semiconductor manufacturing method includes forming a first redistribution structure with a fine redistribution circuitry over a first temporary carrier; forming testing tips on a first surface of the fine redistribution circuitry; transferring the testing tips and the first redistribution structure to a second temporary carrier provided with a temporary adhesive layer, where the testing tips are embedded in the temporary adhesive layer with the second temporary carrier disposed on the temporary adhesive layer; releasing the first temporary carrier to expose a second surface of the fine redistribution circuitry; coupling a second redistribution structure with a coarse redistribution circuitry to the first redistribution structure through conductive joints, where the conductive joints are formed on the second surface of the fine redistribution circuitry; and releasing the second temporary carrier and the temporary adhesive layer from the testing tips and the first redistribution structure after coupling the second redistribution structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Manufacturing method of integrated substrate","description":"A semiconductor manufacturing method includes forming a first redistribution structure with a fine redistribution circuitry over a first temporary carrier; forming testing tips on a first surface of t","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-12009329","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-12009329","citation_suggestion":"Patentable. \"Manufacturing method of integrated substrate\" (US-12009329). https://patentable.app/patents/US-12009329","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-12009329","json":"https://patentable.app/api/llm-context/US-12009329","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T09:43:57.050Z"}