{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-12009352","patent":{"patent_number":"US-12009352","title":"Fabricating wafers with electrical contacts on a surface parallel to an active surface","assignee":null,"inventors":[],"filing_date":"2020-09-16T00:00:00.000Z","publication_date":"2024-06-11T00:00:00.000Z","cpc_codes":["G01N","H01L","G01N","H01L","H01L","H01L","H01L","H01L","H01L","H01L","G01N","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Provided herein include various examples of a method for manufacturing aspects of an apparatus, a sensor system. The method may include obtaining a first carrier bonded to an upper surface of the silicon wafer. This wafer includes through silicon vias (TSVs) extended through openings in a passivation stack, with electrical contacts coupled to portions of the TSVs exposed through these openings. The method may include de-bonding the first carrier from the upper surface of the silicon wafer. The method may include dicing the silicon wafer into subsections comprising dies."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Fabricating wafers with electrical contacts on a surface parallel to an active surface","description":"Provided herein include various examples of a method for manufacturing aspects of an apparatus, a sensor system. The method may include obtaining a first carrier bonded to an upper surface of the sili","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-12009352","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-12009352","citation_suggestion":"Patentable. \"Fabricating wafers with electrical contacts on a surface parallel to an active surface\" (US-12009352). https://patentable.app/patents/US-12009352","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-12009352","json":"https://patentable.app/api/llm-context/US-12009352","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:31:37.791Z"}