{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-12009354","patent":{"patent_number":"US-12009354","title":"SSD wafer device and method of manufacturing same","assignee":null,"inventors":[],"filing_date":"2021-12-10T00:00:00.000Z","publication_date":"2024-06-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"A solid state drive (SSD) wafer device includes first and second semiconductor wafers coupled together. The first wafer may include a number of memory dies with die bond pads, and the second wafer may include a number of electrical interconnects, each including first and second terminals at opposed ends of the electrical interconnect. When the wafers are bonded together, the first terminals of the second wafer are bonded to the die bond pads of the memory dies of the first wafer. The second terminals are left exposed to couple with an SSD controller, which controls the transfer of data and signals between the memory dies of the first wafer and a host device such as a server in a datacenter."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"SSD wafer device and method of manufacturing same","description":"A solid state drive (SSD) wafer device includes first and second semiconductor wafers coupled together. The first wafer may include a number of memory dies with die bond pads, and the second wafer may","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-12009354","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-12009354","citation_suggestion":"Patentable. \"SSD wafer device and method of manufacturing same\" (US-12009354). https://patentable.app/patents/US-12009354","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-12009354","json":"https://patentable.app/api/llm-context/US-12009354","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T07:00:22.101Z"}