{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-12010794","patent":{"patent_number":"US-12010794","title":"Printed wiring board and method for manufacturing the same","assignee":null,"inventors":[],"filing_date":"2022-03-31T00:00:00.000Z","publication_date":"2024-06-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A printed wiring board includes a base insulating layer, a conductor layer formed on the base insulating layer and including conductor pads, a solder resist layer formed on the base insulating layer such that the solder resist layer is covering the conductor layer and having openings exposing the conductor pads, respectively, and plating bumps formed on the conductor pads such that each of the plating bumps includes a base plating layer formed in a respective one of the openings of the solder resist layer, and a top plating layer formed on the base plating layer. The plating bumps are formed such that the base plating layer has an upper surface and a side surface including a portion protruding from the solder resist layer and having a rough surface and that the top plating layer has a hemispherical shape and is covering only the upper surface of the base plating layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Printed wiring board and method for manufacturing the same","description":"A printed wiring board includes a base insulating layer, a conductor layer formed on the base insulating layer and including conductor pads, a solder resist layer formed on the base insulating layer s","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-12010794","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-12010794","citation_suggestion":"Patentable. \"Printed wiring board and method for manufacturing the same\" (US-12010794). https://patentable.app/patents/US-12010794","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-12010794","json":"https://patentable.app/api/llm-context/US-12010794","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T09:45:22.886Z"}