{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-12010850","patent":{"patent_number":"US-12010850","title":"Integrated assemblies which include stacked memory decks, and methods of forming integrated assemblies","assignee":null,"inventors":[],"filing_date":"2023-07-06T00:00:00.000Z","publication_date":"2024-06-11T00:00:00.000Z","cpc_codes":["G11C"],"num_claims":20,"abstract":"Some embodiments include an integrated assembly having a first deck which has first memory cells, and having a second deck which has second memory cells. The first memory cells have first control gate regions which include a first conductive material vertically between horizontally-extending bars of a second conductive material. The second memory cells have second control gate regions which include a fourth conductive material along an outer surface of a third conductive material. A pillar passes through the first and second decks. The pillar includes a dielectric-barrier material laterally surrounding a channel material. The first and fourth materials are directly against the dielectric-barrier material. Some embodiments include methods of forming integrated assemblies."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated assemblies which include stacked memory decks, and methods of forming integrated assemblies","description":"Some embodiments include an integrated assembly having a first deck which has first memory cells, and having a second deck which has second memory cells. The first memory cells have first control gate","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-12010850","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-12010850","citation_suggestion":"Patentable. \"Integrated assemblies which include stacked memory decks, and methods of forming integrated assemblies\" (US-12010850). https://patentable.app/patents/US-12010850","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-12010850","json":"https://patentable.app/api/llm-context/US-12010850","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T05:38:31.778Z"}