{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-12011784","patent":{"patent_number":"US-12011784","title":"Wafer, wafer manufacturing method, device chip manufacturing method, and resistivity markings","assignee":null,"inventors":[],"filing_date":"2021-07-22T00:00:00.000Z","publication_date":"2024-06-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L"],"num_claims":7,"abstract":"A wafer manufacturing method for manufacturing a wafer from an ingot includes forming a peeling layer within the ingot by positioning a condensing point at a depth corresponding to the thickness of the wafer to be produced, and irradiating the ingot with a first laser beam, forming a character, a number, or a mark representing information regarding resistivity in or on the ingot by positioning a condensing point in a region in which devices are not to be formed and irradiating the ingot with a second laser beam, and dividing the ingot with the peeling layer as a starting point."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wafer, wafer manufacturing method, device chip manufacturing method, and resistivity markings","description":"A wafer manufacturing method for manufacturing a wafer from an ingot includes forming a peeling layer within the ingot by positioning a condensing point at a depth corresponding to the thickness of th","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-12011784","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-12011784","citation_suggestion":"Patentable. \"Wafer, wafer manufacturing method, device chip manufacturing method, and resistivity markings\" (US-12011784). https://patentable.app/patents/US-12011784","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-12011784","json":"https://patentable.app/api/llm-context/US-12011784","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T18:03:42.992Z"}