{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8460414","patent":{"patent_number":"US-8460414","title":"Polishing slurry and polishing material using same","assignee":null,"inventors":[],"filing_date":"2006-04-14T00:00:00.000Z","publication_date":"2013-06-11T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":10,"abstract":"Disclosed is a polishing slurry which enables to suppress damages to an under layer while securing an adequate polishing rate. The polishing slurry contains a resin (A) having an amide group and an organic resin (B)."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Polishing slurry and polishing material using same","description":"Disclosed is a polishing slurry which enables to suppress damages to an under layer while securing an adequate polishing rate. The polishing slurry contains a resin (A) having an amide group and an or","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8460414","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8460414","citation_suggestion":"Patentable. \"Polishing slurry and polishing material using same\" (US-8460414). https://patentable.app/patents/US-8460414","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8460414","json":"https://patentable.app/api/llm-context/US-8460414","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T21:09:59.431Z"}