{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8460491","patent":{"patent_number":"US-8460491","title":"Die bonder and bonding method","assignee":null,"inventors":[],"filing_date":"2012-03-07T00:00:00.000Z","publication_date":"2013-06-11T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":11,"abstract":"The present invention provides die bonder and bonding method by which a bonding load from a high load to a low load is obtained or high-speed mounting is attained.In a die bonder or a bonding method in which a bonding head is ascended/descended by a first ascending/descending drive shaft unit, a die is picked up, the picked-up die is installed onto a workpiece, and after installed, a load is exerted on the die by the bonding head to bond the die to the workpiece, whether the load is higher/lower than a predetermined load is determined, and in bonding, when the load is higher than the predetermined load, the high load is exerted by the first ascending/descending drive shaft unit, and when the load is lower than the predetermined load, the low load is exerted by a second ascending/descending drive shaft unit."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Die bonder and bonding method","description":"The present invention provides die bonder and bonding method by which a bonding load from a high load to a low load is obtained or high-speed mounting is attained.In a die bonder or a bonding method i","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8460491","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8460491","citation_suggestion":"Patentable. \"Die bonder and bonding method\" (US-8460491). https://patentable.app/patents/US-8460491","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8460491","json":"https://patentable.app/api/llm-context/US-8460491","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T13:41:33.743Z"}