{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8460968","patent":{"patent_number":"US-8460968","title":"Integrated circuit packaging system with post and method of manufacture thereof","assignee":null,"inventors":[],"filing_date":"2010-09-17T00:00:00.000Z","publication_date":"2013-06-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method of manufacture of an integrated circuit packaging system includes: providing a stack substrate with a component side; connecting an integrated circuit component to the component side; attaching a conductive post to the component side and adjacent the integrated circuit component, the conductive post having a protruded end above the integrated circuit component; forming a protection layer on a top and sides of the protruded end, the protection layer having a width equal to a width of the conductive post; applying a stack encapsulation over the integrated circuit component, over the stack substrate, and around a portion of the conductive post, the protection layer exposed from the stack encapsulation; and mounting a base package under the stack substrate, base package connected to the stack substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit packaging system with post and method of manufacture thereof","description":"A method of manufacture of an integrated circuit packaging system includes: providing a stack substrate with a component side; connecting an integrated circuit component to the component side; attachi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8460968","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8460968","citation_suggestion":"Patentable. \"Integrated circuit packaging system with post and method of manufacture thereof\" (US-8460968). https://patentable.app/patents/US-8460968","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8460968","json":"https://patentable.app/api/llm-context/US-8460968","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:16:46.517Z"}