{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8460972","patent":{"patent_number":"US-8460972","title":"Method of forming semiconductor package","assignee":null,"inventors":[],"filing_date":"2010-07-05T00:00:00.000Z","publication_date":"2013-06-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":7,"abstract":"A method of forming a semiconductor package includes providing a transfer film and placing electronic components on the transfer film with active sides of the electronic components facing the transfer film. The electronic components include a first assembled package and one or more of a second assembled package and a passive component. A molding operation is performed to encapsulate the electronic components and one side of the transfer film. The transfer film is then removed, which exposes the active sides of the electronic components. An electrical distribution layer is formed over the active sides of the electronic components and electrically connects the electronic components. Conductive bumps are then formed on the electrical distribution layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of forming semiconductor package","description":"A method of forming a semiconductor package includes providing a transfer film and placing electronic components on the transfer film with active sides of the electronic components facing the transfer","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8460972","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8460972","citation_suggestion":"Patentable. \"Method of forming semiconductor package\" (US-8460972). https://patentable.app/patents/US-8460972","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8460972","json":"https://patentable.app/api/llm-context/US-8460972","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:37:33.277Z"}