{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8461588","patent":{"patent_number":"US-8461588","title":"In-situ monitoring and method to determine accumulated printed wiring board thermal and/or vibration stress fatigue using a mirrored monitor chip and continuity circuit","assignee":null,"inventors":[],"filing_date":"2009-12-01T00:00:00.000Z","publication_date":"2013-06-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":12,"abstract":"A monitoring system includes a monitor chip or chips soldered to a printed wiring board. By mirroring a function IC chip interface with the monitor chip, the consumed and remaining thermal/and or vibration-fatigue life of the function IC chip based on the life-environment actually experienced through monitoring of the monitor chip is readily determined. The monitor chip includes monitoring interconnections and/or circuitry which determines the number and/or location of failed-open solder terminations of the monitor chip."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"In-situ monitoring and method to determine accumulated printed wiring board thermal and/or vibration stress fatigue using a mirrored monitor chip and continuity circuit","description":"A monitoring system includes a monitor chip or chips soldered to a printed wiring board. By mirroring a function IC chip interface with the monitor chip, the consumed and remaining thermal/and or vibr","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8461588","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8461588","citation_suggestion":"Patentable. \"In-situ monitoring and method to determine accumulated printed wiring board thermal and/or vibration stress fatigue using a mirrored monitor chip and continuity circuit\" (US-8461588). https://patentable.app/patents/US-8461588","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8461588","json":"https://patentable.app/api/llm-context/US-8461588","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:07:53.885Z"}