{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8461589","patent":{"patent_number":"US-8461589","title":"Circuit having integrated heating structure for parametric trimming","assignee":null,"inventors":[],"filing_date":"2012-06-05T00:00:00.000Z","publication_date":"2013-06-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An integrated circuit (IC) includes a heated portion. The heated portion/IC includes a substrate having a topside semiconductor surface having circuitry configured to provide a circuit function. A pre-metal dielectric (PMD) layer is on the topside semiconductor surface. A metal interconnect stack is on the PMD. A trim portion includes one or more temperature sensitive circuit components which affect a temperature behavior of the IC. The heated portion extends over and beyond an area of the trim portion having an integrated heating structure including at least a first heater formed from a metal interconnect level that includes a first plurality of winding segments which have a varying pitch. A heat spreader formed from a second metal interconnect layer is between trim portion and the first heater. Thermal plugs are lateral to the temperature sensitive circuit components and thermally couple the heat spreader to the topside semiconductor surface."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Circuit having integrated heating structure for parametric trimming","description":"An integrated circuit (IC) includes a heated portion. The heated portion/IC includes a substrate having a topside semiconductor surface having circuitry configured to provide a circuit function. A pre","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8461589","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8461589","citation_suggestion":"Patentable. \"Circuit having integrated heating structure for parametric trimming\" (US-8461589). https://patentable.app/patents/US-8461589","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8461589","json":"https://patentable.app/api/llm-context/US-8461589","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T23:56:54.569Z"}