{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8461614","patent":{"patent_number":"US-8461614","title":"Packaging substrate device, method for making the packaging substrate device, and packaged light emitting device","assignee":null,"inventors":[],"filing_date":"2010-04-02T00:00:00.000Z","publication_date":"2013-06-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":11,"abstract":"A packaging substrate device includes: a first laminate including a first ceramic substrate and a first copper pattern disposed on an upper surface of the first ceramic substrate; and a second laminate disposed over the first copper pattern and including a second ceramic substrate, a second copper pattern that is disposed on an upper surface of the second ceramic substrate, and a through hole extending through the second ceramic substrate and the second copper pattern to expose a copper portion of the first copper pattern. A light emitting semiconductor die can be mounted on the copper portion within the through hole. Efficient heat dissipation can be achieved through the first laminate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Packaging substrate device, method for making the packaging substrate device, and packaged light emitting device","description":"A packaging substrate device includes: a first laminate including a first ceramic substrate and a first copper pattern disposed on an upper surface of the first ceramic substrate; and a second laminat","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8461614","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8461614","citation_suggestion":"Patentable. \"Packaging substrate device, method for making the packaging substrate device, and packaged light emitting device\" (US-8461614). https://patentable.app/patents/US-8461614","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8461614","json":"https://patentable.app/api/llm-context/US-8461614","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T05:03:28.668Z"}