{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8461665","patent":{"patent_number":"US-8461665","title":"Wafer and package product manufacturing method","assignee":null,"inventors":[],"filing_date":"2011-05-24T00:00:00.000Z","publication_date":"2013-06-11T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":2,"abstract":"A wafer is provided that is stacked on and anodically bonded to another wafer to form a plurality of package products each having a cavity in which an operation piece is contained between the wafers. The wafers has a product area in which a plurality of concave portions are formed each of which will be part of the cavity when stacked on the another wafer, and grooves or slits are formed extending from the central portion in radial direction to the outside in radial direction of the wafer and reaching the outside of the product area."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wafer and package product manufacturing method","description":"A wafer is provided that is stacked on and anodically bonded to another wafer to form a plurality of package products each having a cavity in which an operation piece is contained between the wafers. ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8461665","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8461665","citation_suggestion":"Patentable. \"Wafer and package product manufacturing method\" (US-8461665). https://patentable.app/patents/US-8461665","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8461665","json":"https://patentable.app/api/llm-context/US-8461665","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T21:46:40.081Z"}