{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8461680","patent":{"patent_number":"US-8461680","title":"Integrated circuit packaging system with rounded interconnect","assignee":null,"inventors":[],"filing_date":"2011-10-12T00:00:00.000Z","publication_date":"2013-06-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"An integrated circuit packaging system includes: a package carrier; an integrated circuit attached to the package carrier; a rounded interconnect on the package carrier; and an encapsulation over the package carrier covering the integrated circuit and exposing the rounded interconnect having a characteristic free of denting."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit packaging system with rounded interconnect","description":"An integrated circuit packaging system includes: a package carrier; an integrated circuit attached to the package carrier; a rounded interconnect on the package carrier; and an encapsulation over the ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8461680","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8461680","citation_suggestion":"Patentable. \"Integrated circuit packaging system with rounded interconnect\" (US-8461680). https://patentable.app/patents/US-8461680","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8461680","json":"https://patentable.app/api/llm-context/US-8461680","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:50:48.058Z"}