{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8461698","patent":{"patent_number":"US-8461698","title":"PCB external ground plane via conductive coating","assignee":null,"inventors":[],"filing_date":"2010-09-28T00:00:00.000Z","publication_date":"2013-06-11T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":6,"abstract":"An integrated circuit assembly (ex.—a flip chip package, a wire bond chip package) is provided which includes a substrate (ex.—a printed circuit board) and a die assembly. The die assembly includes an integrated circuit chip which is connected to the printed circuit board. Further, an external dielectric layer (ex.—a solder mask layer) of the printed circuit board is at least substantially coated with a conductive coating (ex.—a low sintering temperature, nano-particle silver coating). The conductive coating is not in contact with the die assembly and/or passive electronics which are connected to the printed circuit board, however the conductive coating is electrically connected to the printed circuit board. The conductive coating provides (ex—acts as) an external ground plane for the printed circuit board."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"PCB external ground plane via conductive coating","description":"An integrated circuit assembly (ex.—a flip chip package, a wire bond chip package) is provided which includes a substrate (ex.—a printed circuit board) and a die assembly. The die assembly includes an","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8461698","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8461698","citation_suggestion":"Patentable. \"PCB external ground plane via conductive coating\" (US-8461698). https://patentable.app/patents/US-8461698","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8461698","json":"https://patentable.app/api/llm-context/US-8461698","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:19:42.950Z"}