{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8461895","patent":{"patent_number":"US-8461895","title":"Per die temperature programming for thermally efficient integrated circuit (IC) operation","assignee":null,"inventors":[],"filing_date":"2011-10-25T00:00:00.000Z","publication_date":"2013-06-11T00:00:00.000Z","cpc_codes":["G06F","G06F","G06F","G06F"],"num_claims":20,"abstract":"Methods and apparatus to provide per die temperature programming for thermally efficient integrated circuit (IC) operation are described. In some embodiments, the junction temperature of an IC component is determined, e.g., to reduce power consumption and/or improve performance. Other embodiments are also described."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Per die temperature programming for thermally efficient integrated circuit (IC) operation","description":"Methods and apparatus to provide per die temperature programming for thermally efficient integrated circuit (IC) operation are described. In some embodiments, the junction temperature of an IC compone","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8461895","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8461895","citation_suggestion":"Patentable. \"Per die temperature programming for thermally efficient integrated circuit (IC) operation\" (US-8461895). https://patentable.app/patents/US-8461895","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8461895","json":"https://patentable.app/api/llm-context/US-8461895","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T07:45:58.353Z"}