{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8462462","patent":{"patent_number":"US-8462462","title":"Localized heating for flip chip bonding","assignee":null,"inventors":[],"filing_date":"2011-10-20T00:00:00.000Z","publication_date":"2013-06-11T00:00:00.000Z","cpc_codes":["G11B","G11B","G11B","G11B"],"num_claims":26,"abstract":"Embodiments of the present invention relate to integral heating elements in solder pads for flip chip bonding. The integral heating elements are used to solder components together without exposing other locations and components in the assembly to potentially damaging temperatures. Embodiments of the invention may be used in manufacture of magnetic heads for EAMR hard disks to bond a laser sub-mount to an air-bearing slider without exposing magnetic head components to high temperatures."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Localized heating for flip chip bonding","description":"Embodiments of the present invention relate to integral heating elements in solder pads for flip chip bonding. The integral heating elements are used to solder components together without exposing oth","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8462462","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8462462","citation_suggestion":"Patentable. \"Localized heating for flip chip bonding\" (US-8462462). https://patentable.app/patents/US-8462462","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8462462","json":"https://patentable.app/api/llm-context/US-8462462","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T19:45:27.475Z"}