{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8464589","patent":{"patent_number":"US-8464589","title":"Micro-electromechanical systems (MEMS) structure","assignee":null,"inventors":[],"filing_date":"2010-10-14T00:00:00.000Z","publication_date":"2013-06-18T00:00:00.000Z","cpc_codes":["H04R"],"num_claims":20,"abstract":"A MEMS structure includes a substrate, a structural dielectric layer, and a diaphragm. A structural dielectric layer is disposed over the substrate. The diaphragm is held by the structural dielectric layer at a peripheral end. The diaphragm includes multiple trench/ridge rings at a peripheral region surrounding a central region of the diaphragm. A corrugated structure is located at the central region of the diaphragm, surrounded by the trench/indent rings."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Micro-electromechanical systems (MEMS) structure","description":"A MEMS structure includes a substrate, a structural dielectric layer, and a diaphragm. A structural dielectric layer is disposed over the substrate. The diaphragm is held by the structural dielectric ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8464589","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8464589","citation_suggestion":"Patentable. \"Micro-electromechanical systems (MEMS) structure\" (US-8464589). https://patentable.app/patents/US-8464589","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8464589","json":"https://patentable.app/api/llm-context/US-8464589","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T20:56:57.766Z"}