{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8466372","patent":{"patent_number":"US-8466372","title":"Wiring board with built-in electronic component and method for manufacturing the same","assignee":null,"inventors":[],"filing_date":"2009-09-08T00:00:00.000Z","publication_date":"2013-06-18T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"A wiring board with a built-in electronic component includes a core substrate having a penetrating hole formed in the core substrate, an electronic component accommodated in the penetrating hole in the core substrate, a conductive pattern layer formed on a first surface of the core substrate and including a first conductive pattern and a second conductive pattern, and an interlayer insulation layer formed over the conductive pattern layer and the first surface of the core substrate. The second conductive pattern is formed adjacent to a periphery of the penetrating hole and contoured such that a sheet for positioning the electronic component in the penetrating hole is laminated horizontally with respect to the first surface of the core substrate over the penetrating hole."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wiring board with built-in electronic component and method for manufacturing the same","description":"A wiring board with a built-in electronic component includes a core substrate having a penetrating hole formed in the core substrate, an electronic component accommodated in the penetrating hole in th","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8466372","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8466372","citation_suggestion":"Patentable. \"Wiring board with built-in electronic component and method for manufacturing the same\" (US-8466372). https://patentable.app/patents/US-8466372","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8466372","json":"https://patentable.app/api/llm-context/US-8466372","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:47:16.957Z"}