{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-8466486","patent":{"patent_number":"US-8466486","title":"Thermal management system for multiple heat source devices","assignee":null,"inventors":[],"filing_date":"2010-08-27T00:00:00.000Z","publication_date":"2013-06-18T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":20,"abstract":"The present disclosure provides systems and methods for forming a semiconductor device. The semiconductor device includes a substrate having a first side and a second side opposite the first side. A first heat producing element is formed on the first side of the substrate. A second heat producing element is formed on the first side of substrate co-planar with, but not touching the first heat producing element. A heat spreader is coupled to the second side of the substrate using a thermal interface material. The heat spreader includes a first and second vapor chambers. The first vapor chamber is embedded in the heat spreader substantially opposite the first heat producing element. The second vapor chamber is embedded in the heat spreader substantially opposite the second heat producing element. As an example, the first heat producing element may be a light-emitting diode (LED) and the second heat producing element may be a driver circuit for the LED."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Thermal management system for multiple heat source devices","description":"The present disclosure provides systems and methods for forming a semiconductor device. The semiconductor device includes a substrate having a first side and a second side opposite the first side. A f","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-8466486","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-8466486","citation_suggestion":"Patentable. \"Thermal management system for multiple heat source devices\" (US-8466486). https://patentable.app/patents/US-8466486","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-8466486","json":"https://patentable.app/api/llm-context/US-8466486","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:58:21.336Z"}